EpoxyBond 110 Use and Mixing Instructions
Also listed as: PRODUCT USE INSTRUCTIONS
Refer to the original PDF for tables, figures and page layout.
Page 1\nProduct Guide \nwww.alliedhightech.com \nAllied High Tech Products, Inc. \nCall for more information: 800.675.1118 \nEpoxyBond 110 2-Part Epoxy Adhesive \nDate: 10/2020, v1.8\nRefer to the SDS document for additional safety information. \nEpoxyBond 110 is a hard, fast-curing, two-component, epoxy adhesive that turns red \nwhen cured. The two-part formula is mixed 10:1 by volume, cures bubble-free in five \nminutes at 150 °C (302 °F) and only reacts when heat is applied. Once cured, it is \nresistant to most chemical etchants and will not outgas under vacuum. \nEpoxyBond 110 is commonly used to bond glass cover slips to small or delicate \nsamples such as IC devices, adhere multiple samples for TEM stacking, pre-coat \nsamples prior to encapsulation and fill PCB microvias, among other mounting \napplications. EpoxyBond 110 can be applied with a brush or dropper. It has excellent \nadhesion to many different types of materials, including metals, ceramics, glass and \nmost plastics. \nInstructions – IC Cover Slip Technique \nThis technique is recommended for when the IC does not have a passivation layer, \nwhen rounding occurs during cross-sectioning or for bond pad protection. \n1. Using the droppers provided with the bottles, mix 10 drops of Part A (resin) with 1\ndrop of Part B (hardener) in a mixing cup. Mix thoroughly with a stir stick until the\nliquids are homogenous in color and no striations appear.\n2. Using the stir stick, drip the mixed EpoxyBond 110 onto a glass cover slip\n(#72-20000) so that the epoxy covers an area slightly larger than the sample.\n3. Place the sample into the epoxy, circuit side down, so that the edge of the die\nbeing cross-sectioned is near the edge of the glass cover slip.\n4. Use an alligator clip to clamp the sample and glass slide together. The pressure will\ncreate a thin bond line that allows the sample to be viewed under a microscope\nthrough the epoxy. Place the clamped sample into an oven or onto a hot plate at\nthe appropriate temperature.\n5. For best results, determine if the epoxy is cured by its color, not by time. Cured\nEpoxyBond 110 will be a deep, brick red. Once the epoxy has cured, let it cool\nNote: Do not quench cool EpoxyBond 110.\n6. Grind sharp corners and excess glass from the edges of the die. The edges may\nalso be scored with a scribe and then broken. This will eliminate scoring of the\nabrasive films used for polishing.\n \nGHS09 \n \nGHS05 \n\n\nPage 2\n2 of 2 \nStorage \nKeep the containers closed when not in use, and do not store above 48 °C (120 °F). \nThe shelf life is one (1) year when stored at room temperature. Refrigeration is not \nrequired. \nRemoval \nCured EpoxyBond 110 can be removed from a sample using Epoxy Dissolver \n(#145-50210). Please refer to the Epoxy Dissolver instructions for details. \nTechnical Information \nMixing Ratio (by volume) \n10:1 (Part A:Part B) \nCuring Schedule (minutes) \n5 at 150 °C (302 °F) \n10 at 120 °C (248 °F) \n30 at 100 °C (212 °F) \nPhysical Properties – As-Mixed \nPot Life \n8 hours at 24 °C (75 °F) \nViscosity \n350-5850 cP (at 100RPM/23 °C)\nPhysical Properties – As-Cured \nLap Shear Strength \n2440 psi at 23 °C (74 °F) \nDie Shear Strength \n10 kg/3400 psi at 23 °C (74 °F) \nTensile Strength \n10,000 psi at 23 °C (74 °F) \nFlexural Strength \n18,000 psi at 23 °C (74 °F) \nStorage Modulus \n322,000 psi at 23 °C (74 °F) \nPercent Elongation \n1.2 at 23 °C (74 °F) \nWater Absorption \n0.05% after 24 hours at 25 °C (77 °F) \n0.1% after 2 hours at 100 °C (212 °F) \nElectrical Properties – As-Cured \nDielectric Strength \n450 V/mil \nDielectric Constant \n3.74 at 1 kHz \nVolume Resistivity \n≥ 2 x 1013 Ohm-cm at 23 °C (74 °F) \nPower Factor \n0.003 at 1 kHz \nDissipation Factor \n0.011 at 1 kHz \nThermal Properties \nFlash Point \nPart A \n204 °C (400 °F) \nPart B \n93 °C (200 °F) \nGlass Transition Temperature (Tg) \n≥ 90 °C (194 °F) \nHeat Deflection Temperature \n150 °C (302 °F) \nDegradation Temperature (TGA) \n375 °C (707 °F) \nCoefficient of Thermal \nExpansion (CTE) \nBelow Tg \n39 x 10-6 in/in/°C \nAbove Tg \n175 x 10-6 in/in/°C \nwww.alliedhightech.com \nAllied High Tech Products, Inc. \nCall for more information: 800.675.1118 \n