EpoxyBond 14 Use and Mixing Instructions
Also listed as: PRODUCT USE INSTRUCTIONS
Refer to the original PDF for tables, figures and page layout.
Page 1\n \nEpoxyBond 14™ Product Use Instructions \n \n \n \n \n \n \n \nWarning/Danger \n \n \n \n \n \n \n \nRefer to the SDS document for additional \nsafety information. \n \nProtective Equipment \n \n \n \n \n \nMeasuring/Mixing Directions \n \n1) Place a small measuring/mixing cup (#71-10000-C) on a scale \nand tare/zero the display. \n2) With a pipette, transfer the desired volume of Part A into the \nmeasuring/mixing cup. Calculate the desired weight of Part B \nneeded by multiplying the weight of A by 0.25. \n3) Tare/zero the display, then use a pipette to draw and transfer \nPart B into the measuring/mixing cup until the value reflects \nthe addition of the 25% weight of Part B. \n4) Remove and thoroughly mix the components for at least 30 s \nto ensure homogeneity of the mixture. \n5) Use as needed based on the application. \n \nApplication Examples \n \nFill open/decapsulated cavities to stabilize for \ncross-section or backside prep/thinning of \nthe die. \n \n \n \n \n \nFor porous rock/geological samples, the low viscosity of EpoxyBond \n14™ effectively penetrates open cavities to help stabilize the open \nmatrix to keep it together when grinding/polishing. \n \n \nRev A: 5/2021 \nDescription \nEpoxyBond 14™ is a pourable, low viscosity, clear, \ntwo-part, amine-based epoxy adhesive. It is both \nchemical resistant and stable under high vacuum \nwhen cured. \n \nThe (#71-10025) kit is supplied with forty (40) mixing \ncups. Pipettes are needed for transferring part A and B \ninto the mixing cups and a scale with 0.01 g resolution is \nrecommended. \n \nDifferent batches, product age, storage conditions and \napplications may yield varying results. \n \n \nMixing Ratio, by WEIGHT \n4:1 (Part A: Part B) \n \nCuring Schedule \n1 h @ 65 °C \nOR \n24 h @ 23 °C \n \nSpecifications \nPot Life = 1-2 hours, at 24 °C (75 °F) \nViscosity = 100-200 cps (@ 100 RPM/23 °C) \n \nCured Hardness \n~ 85 Shore D \n \n \nApplications \nEpoxyBond 14™ is intended for use in low volume \napplications. In geological/petrographic applications it is \nexcellent for adhering porous rock samples to glass slides \nprior to grinding/polishing. \n \nFor electronic applications it fills in open cavities of \ndecapsulated die in package for backside thinning for FA \nand can be used to fill/stabilize open cavity LED modules. \nFor PCB microvias, it is effective (with vacuum) filling \nopen vias where acrylics may not adequately penetrate to \nprovide the necessary support for cross-sectioning. \n \nEpoxyBond 14™ is soluble in #145-50210 Epoxy \nDissolver. \n \n \nStorage/Shelf Life \nKeep containers stored at room temperature – refrigeration is \nunnecessary and not recommended. \n Expected shelf life is one (1) year but refer to best by date \nprovided on package to ensure freshness. \n \nFor additional information or questions, please contact us at: \ninfo@alliedhightech.com \nEpoxyBond 14 \nTwo-Part Epoxy Adhesive \nGHS08 \nGHS09 \nGHS05 \n