EpoxyMount Use & Mixing Instructions
Also listed as: PRODUCT USE INSTRUCTIONS
Refer to the original PDF for tables, figures and page layout.
Page 1\nProduct Guide \nEpoxyMount Epoxy Mounting Resin \nDate: 02/2021, v1.7 \nRefer to the SDS document for \nadditional safety information. \nEpoxyMount is a clear, 2-hour, room \ntemperature curing, cold mounting \nepoxy resin for potting/encapsulation \nof metallographic samples. It exhibits \nexcellent adhesion, very low shrinkage, \nand low viscosity, allowing it to \npenetrate open pores and cavities to \nmaximize edge retention and support. \nInstructions \n1. Clean the sample using micro organic soap, isopropyl alcohol and/or an ultrasonic\ncleaner to improve mounting material adhesion and prevent outgassing. Dry with heat\nor clean air to remove all moisture prior to mounting.\n2. Using a scale with 0.1 g precision, weigh and mix components in a single plastic cup.\nNote: Do not use wax lined or paper cups. Unless they are cooled in water, the use of\ndisposable mounting cups is also not recommended to avoid melting the cup itself.\n3. Mix thoroughly by scraping both the sides and bottom of the mixing cup for\napproximately 2-3 minutes until the mixture appears homogenous.\n4. Pour the mixture over the sample in the mounting cup.\n5. Let the mount harden/cure.\nNote: If pouring more than 200 g of epoxy at once, the epoxy may generate too much heat \nand cause smoking and fuming, as well as degradation of the sample and the mold. Reducing \nthe amount of epoxy mixed and poured at once may help reduce heat and allow for a better \ncure. It is recommended to mix about 150 g at a time and to pour no more than can cover \n0.5"-1" segments. Use of a conductive mold, like a steel cylinder, can also reduce heat. \nEliminating Bubbles & Air Pockets \nVacuum impregnation and/or a pressure chamber can be used to eliminate bubble formation by \nfilling open pores and cavities, which can interfere with adhesion of the mounting resin to the \nsample and can collect debris during grinding and polishing. Debris will contaminate the \npolishing cloths, leaving scratches on the polished surface. After pouring the epoxy, place the \ncup into the vacuum chamber and vacuum for 3-5 minutes at 25-30 inHg. Release the vacuum \nslowly. Then, cure the mount in a pressure chamber at 25-30 psi. \nTechnical Information \nMixing Ratio (by weight) \n10:3 (Resin: Hardener)* \nMixed Viscosity \n350-500 cP\nCuring Schedule \n(Room Temperature) \n(1.25" ø x 1" H mount) \n2 hours* \nPot Life \n25 minutes at 100 g \nPeak Exothermic \nCuring Temperature \n66 °C (150 °F)* \nDurometer Hardness \n87D \nShrinkage \n0.00008%, Inch/Inch \nIzod Impact/Tensile Strength \n0.94/7600 psi \nGlass Transition \nTemperature \n140 °C (284 °F) \nLight Refractive Index \n1.519 \n* Optimum mixing ratio; larger volume mixtures cure at higher\ntemperatures and faster rates.\nGHS07 \nGHS05 \nGHS09 \nwww.alliedhightech.com \nAllied High Tech Products, Inc. \nCall for more information: 800.675.1118 \n\n\nPage 2\nwww.alliedhightech.com \nAllied High Tech Products, Inc. \nCall for more information: 800.675.1118 \n2 of 2 \nTable 1: EpoxyMount Standard Curing Parameters \nMount Size \nCure Time \n(Hours)* \nMixing Ratio \nWeight (g)** \nResin \nHardener \n1"/ 25 mm \n2-3\n10:3.5 \n10.77 \n3.77 \n1.25"/ 32 mm \n1.5-2 \n10:3 \n17.5 \n5.25 \n1.5"/ 38 - 40 mm \n1-1.5\n10:3 \n25.19 \n7.56 \n2"/ 50 mm \n1-2\n10:2.5 \n36.67 \n9.17 \n* Variations in room temperature and mixing ratios will influence performance and the data in the table above. The\nlarger the mass, the higher the exothermic temperature reached during curing and the faster the epoxy will cure.\nPlace large molds into a shallow bath of water to reduce exothermic heat. Measure both parts with the same cup.\n** Per one (1) mount \n45-Minute Cure Time\nThe cure time for EpoxyMount can be shortened from 2 hours to 45 minutes by adding heat. \nOnce a mount is ready to cure, heat it on a hot plate or in an oven at 38 °C (100 °F) for 10-15 \nminutes. This is not recommended for heat-sensitive specimens. \nBack-Filling \nBack-filling is a process where a sample with an inaccessible area that needs support is \nmounted, ground to expose the air pocket and then remounted in epoxy. Vacuum is used to \npull the air from the pocket that is displaced with epoxy, providing support to the structure. \nWhen back-filling, be sure to use enough epoxy to fully cure and harden. \nCrystallization \nWhen stored in cool conditions, crystallization of the resin (Part A) may occur. To dissolve the \ncrystals, loosen the cap and heat the bottle to 38 °C (100 °F) for 30 minutes. Allow it to cool to \nroom temperature before using. \nSample Removal \nEpoxyMount is non-soluble in water when cured. If a sample needs to be removed from epoxy \nthat is cured or not fully cured, it can be dissolved using Allied’s Epoxy Dissolver (#145-50210). \nThe time required to dissolve the epoxy can be reduced if the excess is ground or cut prior. \n