EpoxySet Use & Mixing Instructions
Also listed as: PRODUCT USE INSTRUCTIONS
Refer to the original PDF for tables, figures and page layout.
Page 1\nProduct Guide \nwww.alliedhightech.com \nAllied High Tech Products, Inc. \nCall for more information: 800.675.1118 \nEpoxySet Epoxy Mounting Resin \nDate: 10/2020, v1.7 \nRefer to the SDS document for \nadditional safety information. \nEpoxySet is a colorless, clear cold \nmounting epoxy resin for \npotting/encapsulation of metallographic \nsamples that cures in 8 hours at room \ntemperature. It exhibits excellent \nadhesion, very low shrinkage and \nminimal viscosity, allowing it to \npenetrate open pores and cavities to \nmaximize edge retention and support. \nInstructions \n1. Clean the sample using micro organic soap, isopropyl alcohol and/or an ultrasonic\ncleaner to improve mounting material adhesion and prevent outgassing. Dry with heat\nor clean air to remove all moisture prior to mounting.\n2. Using a scale with 0.1 g precision, weigh and mix components in a single plastic cup.\nNote: Do not use wax lined or paper cups. Unless they are cooled in water, the use of\ndisposable mounting cups is also not recommended to avoid melting the cup itself.\n3. Mix thoroughly by scraping both the sides and bottom of the mixing cup for\napproximately 2-3 minutes until the mixture appears homogenous.\n4. Pour the mixture over the sample in the mounting cup.\n5. Let the mount harden/cure.\nNote: If pouring more than 200 g of epoxy at once, the epoxy may generate too much heat \nand cause smoking and fuming, as well as degradation of the sample and the mold. Reducing \nthe amount of epoxy mixed and poured at once may help reduce heat and allow for a better \ncure. It is recommended to mix about 150 g at a time and to pour no more than can cover \n0.5"-1" segments. Use of a conductive mold, like a steel cylinder, can also reduce heat. \nTechnical Information \nMixing Ratio (by weight) \n100:12 (Resin:Hardener)* \nMixed Viscosity \n300 cP \nCuring Schedule \n(Room Temperature) \n(1.25" ø x 1" H mount) \n6-10 hours*\nPot Life \n2 hours @ 100 g \nPeak Exothermic \nCuring Temperature \n54 °C (130 °F)* \nDurometer Hardness \n89D \nShrinkage \n0.00008%, Inch/Inch \nIzod Impact/Tensile \nStrength \n0.94/7600 psi \nGlass Transition \nTemperature \n55-75 °C (131-167 °F)\nLight Refractive Index \n1.519 \n* Optimum mixing ratio; larger volume mixtures cure at\nhigher temperatures and faster rates.\nGHS07 \nGHS08 \nGHS05 \nGHS09 \n\n\nPage 2\n2 of 2 \nTable 1: EpoxySet Standard Curing Parameters \nMount Size \nCure Time \n(Hours)* \nMixing Ratio \nWeight (g)** \nResin \nHardener \n1"/ 25 mm \n8-10\n100:13 \n12.87 \n1.67 \n1.25"/ 32 mm \n6-8\n100:12 \n20.31 \n2.44 \n1.5"/ 38 - 40 mm \n4-6\n100:11 \n29.51 \n3.25 \n2"/ 50 mm \n3-4\n100:8.5-10 \n41.67 \n4.17 \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \nwww.alliedhightech.com \nAllied High Tech Products, Inc. \nCall for more information: 800.675.1118 \ntime required to dissolve the epoxy can be reduced if the excess is ground or cut prior.\nis cured or not fully cured, it can be dissolved using Allied’s Epoxy Dissolver (#145-50210). The\nEpoxySet is non-soluble in water when cured. If a sample needs to be removed from epoxy that\nSample Removal\nWhen back-filling, be sure to use enough epoxy to fully cure and harden.\npull the air from the pocket that is displaced with epoxy, providing support to the structure.\nmounted, ground to expose the air pocket and then remounted in epoxy. Vacuum is used to\nBack-filling is a process where a sample with an inaccessible area that needs support is\nBack-Filling\nnot recommended for heat-sensitive specimens.\nmount is ready to cure, heat it on a hot plate or in an oven at 38 °C (100 °F) for 1 hour. This is\nThe cure time for EpoxySet can be shortened from 8 hours to 2 hours by adding heat. Once a\n2-Hour Cure Time\nslowly. Then, cure the mount in a pressure chamber at 25-30 psi.\ncup into the vacuum chamber and vacuum for 3-5 minutes at 25-30 inHg. Release the vacuum\npolishing cloths, leaving scratches on the polished surface. After pouring the epoxy, place the\nsample and can collect debris during grinding and polishing. Debris will contaminate the\nfilling open pores and cavities, which can interfere with adhesion of the mounting resin to the\nVacuum impregnation and/or a pressure chamber can be used to eliminate bubble formation by\nEliminating Bubbles & Air Pockets\n** Per one (1) mount\nmolds into a shallow bath of water to reduce temperature. Measure both parts with the same cup. \nlarger the mass, the higher the temperature reached during curing and the faster the epoxy will cure.Place large \n* Variations in room temperature and mixing ratios will influence performance and the data in the table above. The\n