{
  "title": "NEW 2023 Catalog/Brochure for Allied's X-Prep® Precision Milling/Grinding/Polishing System",
  "kind": "reference",
  "company": "Allied High Tech Products",
  "category": "Lapping, honing & superfinishing",
  "parameters": {
    "Language": "English",
    "Captured": "2026-10-17"
  },
  "language": "en",
  "source_url": "https://www.alliedhightech.com/news/new-2023-catalog-brochure-for-allied-s-x-prep%C2%AE-precision-milling-grinding-polishing-system",
  "content_html": "<div>\n                            <div>\n<article>\n    <div>\n    <header>\n        \n\n<h2>NEW 2023 Catalog/Brochure for Allied's X-Prep® Precision Milling/Grinding/Polishing System</h2>\n\n\n    </header>\n    <div>\n    <div>\n        <div>\n                <p></p>\n<p><a href=\"https://issuu.com/alliedhightechproductsinc/docs/xprep_brochure_2022_digital\" title=\"X-Prep Catalog 2023\" rel=\"noopener noreferrer\"><img src=\"/files/allied-file-ec658c810005d5bc2a77e1db/XPREP-Brochure-2023-Cover.jpg\" alt=\"\" loading=\"lazy\" style=\"max-height:440px;width:auto\"></a></p>\n<p></p>\n<p>The X-Prep® milling/grinding/polishing system allows thinning of non-flat/warped silicon and other substrates with unmatched accuracy. Featuring a user-friendly interface through a 12\" color touchscreen, operators of all skill levels can use the machine for a wide variety of applications. No special programming (like G-code) is necessary, as the user is led automatically through the setup routine and guided throughout the sample preparation procedure. This ensures repeatability and accuracy as the X-Prep® keeps track of all necessary steps.</p>\n<p>The X-Prep® has been engineered with advanced components and technology to deliver sophisticated, unmatched results to give you exactly what you need in a sample preparation tool.</p>\n        </div>\n    </div>\n    </div>\n    </div>\n</article></div>\n                        </div>\n                    ",
  "summary": "NEW 2023 Catalog/Brochure for Allied's X-Prep® Precision Milling/Grinding/Polishing System The X-Prep® milling/grinding/polishing system allows thinning of non-flat/warped silicon and other substrates with unmatched accuracy. Featuring a user-friendly interface through a 12\" color touchscreen, operators of all skill levels can use the machine for a wide variety of applications. No special programming (like G-code) is necessary, as the user is led automatically through the setup routine and…",
  "sections": [],
  "updated_at": "2026-10-17T21:12:06.592434+00:00"
}