{
  "title": "Successfully developed compound semiconductor grinding and polishing solutions",
  "kind": "reference",
  "company": "GRISH / Beijing Grish Hitech",
  "category": "Compounds & slurries",
  "parameters": {
    "Brand / publisher": "GRISH",
    "Content type": "company",
    "Language": "English"
  },
  "language": "en",
  "source_url": "https://grish.com/history/2020/",
  "content_html": "<p>GRISH R&amp;D team has innovated solution for compound semiconductor polishing, this lapping process can effectively reduce the scratch rate of processed wafers, with a qualified rate of more than 95% of finished products, a damage layer &lt;5μm, good surface finish, 2-3 times higher grinding and polishing efficiency, and 30-40% less consumables used than the traditional process.\n</p>\n",
  "summary": "GRISH R&D team has innovated solution for compound semiconductor polishing, this lapping process can effectively reduce the scratch rate of processed wafers, with a qualified rate of more than 95% of finished products, a damage layer <5μm, good surface finish, 2-3 times higher grinding and polishing efficiency, and 30-40% less consumables used than the traditional process.",
  "sections": [],
  "updated_at": "2026-10-16"
}