{
  "title": "TTV (Total Thickness Variation)",
  "kind": "reference",
  "company": "GRISH / Beijing Grish Hitech",
  "category": "Lapping, honing & superfinishing",
  "parameters": {
    "Brand / publisher": "GRISH",
    "Content type": "glossary",
    "Language": "English"
  },
  "language": "en",
  "source_url": "https://grish.com/term/ttv-total-thickness-variation/",
  "content_html": "<p>Total Thickness Variation (TTV) – refers to the difference between the maximum and minimum values of wafer thickness </p>\n",
  "summary": "Total Thickness Variation (TTV) – refers to the difference between the maximum and minimum values of wafer thickness",
  "sections": [],
  "updated_at": "2026-10-16"
}