{
  "title": "Ceramic Substrate Large And Hard Substrate 1151 Susp Plub — Electronic Components",
  "kind": "document",
  "company": "Struers",
  "category": "Lapping, honing & superfinishing",
  "parameters": {
    "Edition": "Listed by source",
    "Material family": "Electronic Components"
  },
  "language": "en",
  "source_url": "https://publications.struers.com/brochures/english/application-notes/methods/ceramic-substrate-large-and-hard-substrate-1151-susp-plubelectronic-components/",
  "content_html": "<p>Struers methods: Ceramic Substrate Large And Hard Substrate 1151 Susp Plub. Source classification: Electronic Components.</p><figure><img src=\"/files/struers-render-10e286555f74db90fb008fa3/struers-doc-22c2b4540267e93ab85ef77b-1.png\" alt=\"Original preparation method, page 1\" loading=\"lazy\"><figcaption>Original method · Page 1</figcaption></figure><details><summary>Searchable text transcription</summary><p>The page images and original PDF preserve the table layout and notation.</p><pre style=\"white-space:pre-wrap;font-size:13px;line-height:1.6\">Grinding\nSteps\nPG\nFG\nFG 2\nSurface\nType\nMD-Piano 220\nMD-Piano 1200\nMD-Largo\nDisc speed (rpm)\n300\n300\n150\nAbrasive\nType \nDP-Susp. P 9 µm\nPredosing/dosing\n3/6\nLubricant\nType \nWater\nWater\nDP-Blue\nPredosing/dosing\n3/6\nForce (N)\n20\n20\n30\nHolder direction\n&gt;&gt;\n&gt;&gt;\n&gt;&gt;\nHolder speed (rpm)\n150\n150\n150\nTime (min)\n1\n3\n5\nPolishing\nSteps\nDP\nOP\nSurface\nType\nMD-Dac\nMD-Chem\nDisc speed (rpm)\n150\n150\nAbrasive\nType \nDP-Susp. P 3 µm\nOP-U, 0.04 µm\nPredosing/dosing\n3/6\n1/10\nLubricant\nType \nDP-Blue\nPredosing/dosing\n3/10\nForce (N)\n30\n10\nHolder direction\n&gt;&gt;\n&gt;&lt;\nHolder speed (rpm)\n150\n150\nTime (min)\n5\n1\nCeramic substrate - Large and hard substrate\n1151\nElectronic Components \n Susp. P/Lub.\nThe method is developed to fit a standard equipment \nconfiguration with 30 mm specimen on 300mm disc. \nDosing levels are valid for following equipment: \nTegramin, AbraPol and LaboPol\nFor advice on how to adjust the method to fit your \nequipment, please take a look at Preparation Parameters.\nThe preparation time for the plane grinding (PG) step \ndepends very much on the condition of the samples and \nif they are prepared as single specimens or clamped in a \nspecimen holder. Please check the samples after the first \nstep and repeat it if necessary.\nMethod comments\nTake a look at Preparation Parameters \n</pre></details>",
  "summary": "Struers methods: Ceramic Substrate Large And Hard Substrate 1151 Susp Plub. Source classification: Electronic Components.",
  "sections": [],
  "updated_at": "2026-10-17"
}