POLISHX/Colloidal Silica Suspension, Non-Stick Formula PRODUCT INFORMATION
Colloidal Silica Suspension, Non-Stick Formula
Consumables > Grinding & Polishing > Colloidal Silica Suspension, Non-Stick Formula An excellent final polishing suspension for most materials, this proprietary formula features a pH of 10 and rinses easily from samples and equipment, even after it dries. It is slow drying, making it an ideal choice for prolonged polishing requirements such as those for EBSD. The pH may be modified with chemical solutions to improve microstructural contrast. SAFETY DATA SHEET Item# Item Name 180-25015 Colloidal…