Conductive Copper Powder Cure Schedule

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Cure Schedule — Copper-Based Conductive

Mold Size

Number

Powder

Cure Time

Temp

Cool Time] Mold Pressure

Diameter

of Scoops | Amount (g)

(min)

(°C/°F)

(min)

(psi)

1"&25 mm

il

24

1

4400

1.25" & 30 mm

1.5

37

1

4000

180/356

1.5" & 40 mm

2

49

1

3800

2" & 50 mm

4

85

1

3500

Notes:

=

For single mounts. If duplexing, 1 minute may need to be added to the cure time.

_

Powder amount may vary depending upon the size of each sample.

=

All samples must be ultrasonically cleaned and dried to remove any debris and/or grease.

=

A mold release agent must be applied every time before a mounting cycle; Allied’s mold release

for hot mounting (#200-10004) is recommended.

Cure cycle times and temperatures may vary for non-Allied presses.