Ultra Pure Silicon Challenge
FTIR quantification of very small concentrations of various elements in ultra pure silicon requires a polished, small, and extremely plane sample. The precision cutting, sectioning 2,250-2,300 um disk-shaped pellets from a small cylindrical piece is a challenging multi-step process. Optimization to a fast and accurate process eliminating the need for epoxy mounting is demonstrated in the solution.
Solution:
Twenty-four hours' curing time from the epoxy gluing process has been eliminated and thereby has also removed a challenging aligning procedure before cutting. Cost cutting has been acheived, as specialized graphite support is no longer needed. A 30-second fixation process in a specialized three-jaw chuck has replaced the epoxy gluing, which also minimizes health and safety issues.
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Electronics ultra-pure silicon preparation insight | Struers.com
How to perform FTIR quantification in ultra-pure silicon for the electronics industry without time-consuming epoxy mounting. Our materialography application specialists demonstrate a fast and reproducible method for preparing ultra-pure silicon for fourier-transform infrared spectroscopy.