Struers methods: Semiconductor Wafers Fg For Very Soft Andor Brittle Parts 1156 Susp Plub. Source classification: Electronic Components.
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Grinding Steps PG FG FG 2 FG 3 Surface Type SiC Foil #500 SiC Foil #1200 SiC Foil #2000 SiC Foil #4000 Disc speed (rpm) 150 150 150 150 Abrasive Type Predosing/dosing Lubricant Type Water Water Water Water Predosing/dosing Force (N) 20 20 20 20 Holder direction >> >> >> >> Holder speed (rpm) 150 150 150 150 Time (min) 1 1 1 1 Semiconductor Wafers - FG for very soft and/or brittle parts 1156 Electronic Components Susp. P/Lub. Polishing Steps DP OP Surface Type MD-Nap MD-Chem Disc speed (rpm) 150 150 Abrasive Type DP-Susp. P 1 µm OP-S, 0.25 µm Predosing/dosing 3/6 1/10 Lubricant Type DP-Blue Predosing/dosing 3/14 Force (N) 30 10 Holder direction >> >< Holder speed (rpm) 150 150 Time (min) 5 1 The method is developed to fit a standard equipment configuration with 30 mm specimen on 300mm disc. Dosing levels are valid for following equipment: Tegramin, AbraPol and LaboPol For advice on how to adjust the method to fit your equipment, please take a look at Preparation Parameters. The preparation time for the plane grinding (PG) step depends very much on the condition of the samples and if they are prepared as single specimens or clamped in a specimen holder. Please check the samples after the first step and repeat it if necessary. Method comments Take a look at Preparation Parameters