Struers methods: Solder Balls 1168 Susp Plub. Source classification: Electronic Components.
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Polishing Steps DP DP 2 OP Surface Type MD-Dur MD-Dur MD-Chem Disc speed (rpm) 150 150 150 Abrasive Type DP-Susp. P 3 µm DP-Susp. P 1 µm OP-S, 0.25 µm Predosing/dosing 3/6 3/6 1/10 Lubricant Type DP-Blue DP-Red Predosing/dosing 3/10 3/10 Force (N) 25 20 10 Holder direction >> >> >< Holder speed (rpm) 150 150 150 Time (min) 5 5 2 Solder balls 1168 Electronic Components Susp. P/Lub. Grinding Steps PG FG Surface Type SiC Foil #500 MD-Largo Disc speed (rpm) 300 150 Abrasive Type DP-Susp. P 9 µm Predosing/dosing 3/6 Lubricant Type Water DP-Blue Predosing/dosing 3/6 Force (N) 25 30 Holder direction >> >> Holder speed (rpm) 150 150 Time (min) 1 6 The method is developed to fit a standard equipment configuration with 30 mm specimen on 300mm disc. Dosing levels are valid for following equipment: Tegramin, AbraPol and LaboPol For advice on how to adjust the method to fit your equipment, please take a look at Preparation Parameters. The preparation time for the plane grinding (PG) step depends very much on the condition of the samples and if they are prepared as single specimens or clamped in a specimen holder. Please check the samples after the first step and repeat it if necessary. Method comments Take a look at Preparation Parameters