Struers methods: Solder Balls 1170 DiaPro. Source classification: Electronic Components.
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Polishing Steps DP DP 2 OP Surface Type MD-Dur MD-Nap MD-Chem Disc speed (rpm) 150 150 150 Abrasive Type DiaPro Dur 3 µm DiaPro Nap R 1 µm OP-S, 0.25 µm Predosing/dosing 3/10 3/14 1/10 Lubricant Type Predosing/dosing Force (N) 25 20 10 Holder direction >> >> >< Holder speed (rpm) 150 150 150 Time (min) 4 4 2 Solder balls 1170 Electronic Components DiaPro Grinding Steps PG FG Surface Type SiC Foil #500 MD-Largo Disc speed (rpm) 300 150 Abrasive Type DiaPro Allegro/Largo 9 µm Predosing/dosing 3/6 Lubricant Type Water Predosing/dosing Force (N) 25 30 Holder direction >> >> Holder speed (rpm) 150 150 Time (min) 1 5 The method is developed to fit a standard equipment configuration with 30 mm specimen on 300mm disc. Dosing levels are valid for following equipment: Tegramin, AbraPol and LaboPol For advice on how to adjust the method to fit your equipment, please take a look at Preparation Parameters. The preparation time for the plane grinding (PG) step depends very much on the condition of the samples and if they are prepared as single specimens or clamped in a specimen holder. Please check the samples after the first step and repeat it if necessary. Method comments Take a look at Preparation Parameters