EpoxyBond 110 Use and Mixing Instructions
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Page 1 Product Guide www.alliedhightech.com Allied High Tech Products, Inc. Call for more information: 800.675.1118 EpoxyBond 110 2-Part Epoxy Adhesive Date: 10/2020, v1.8 Refer to the SDS document for additional safety information. EpoxyBond 110 is a hard, fast-curing, two-component, epoxy adhesive that turns red when cured. The two-part formula is mixed 10:1 by volume, cures bubble-free in five minutes at 150 °C (302 °F) and only reacts when heat is applied. Once cured, it is resistant to most chemical etchants and will not outgas under vacuum. EpoxyBond 110 is commonly used to bond glass cover slips to small or delicate samples such as IC devices, adhere multiple samples for TEM stacking, pre-coat samples prior to encapsulation and fill PCB microvias, among other mounting applications. EpoxyBond 110 can be applied with a brush or dropper. It has excellent adhesion to many different types of materials, including metals, ceramics, glass and most plastics. Instructions – IC Cover Slip Technique This technique is recommended for when the IC does not have a passivation layer, when rounding occurs during cross-sectioning or for bond pad protection. 1. Using the droppers provided with the bottles, mix 10 drops of Part A (resin) with 1 drop of Part B (hardener) in a mixing cup. Mix thoroughly with a stir stick until the liquids are homogenous in color and no striations appear. 2. Using the stir stick, drip the mixed EpoxyBond 110 onto a glass cover slip (#72-20000) so that the epoxy covers an area slightly larger than the sample. 3. Place the sample into the epoxy, circuit side down, so that the edge of the die being cross-sectioned is near the edge of the glass cover slip. 4. Use an alligator clip to clamp the sample and glass slide together. The pressure will create a thin bond line that allows the sample to be viewed under a microscope through the epoxy. Place the clamped sample into an oven or onto a hot plate at the appropriate temperature. 5. For best results, determine if the epoxy is cured by its color, not by time. Cured EpoxyBond 110 will be a deep, brick red. Once the epoxy has cured, let it cool Note: Do not quench cool EpoxyBond 110. 6. Grind sharp corners and excess glass from the edges of the die. The edges may also be scored with a scribe and then broken. This will eliminate scoring of the abrasive films used for polishing. GHS09 GHS05 Page 2 2 of 2 Storage Keep the containers closed when not in use, and do not store above 48 °C (120 °F). The shelf life is one (1) year when stored at room temperature. Refrigeration is not required. Removal Cured EpoxyBond 110 can be removed from a sample using Epoxy Dissolver (#145-50210). Please refer to the Epoxy Dissolver instructions for details. Technical Information Mixing Ratio (by volume) 10:1 (Part A:Part B) Curing Schedule (minutes) 5 at 150 °C (302 °F) 10 at 120 °C (248 °F) 30 at 100 °C (212 °F) Physical Properties – As-Mixed Pot Life 8 hours at 24 °C (75 °F) Viscosity 350-5850 cP (at 100RPM/23 °C) Physical Properties – As-Cured Lap Shear Strength 2440 psi at 23 °C (74 °F) Die Shear Strength 10 kg/3400 psi at 23 °C (74 °F) Tensile Strength 10,000 psi at 23 °C (74 °F) Flexural Strength 18,000 psi at 23 °C (74 °F) Storage Modulus 322,000 psi at 23 °C (74 °F) Percent Elongation 1.2 at 23 °C (74 °F) Water Absorption 0.05% after 24 hours at 25 °C (77 °F) 0.1% after 2 hours at 100 °C (212 °F) Electrical Properties – As-Cured Dielectric Strength 450 V/mil Dielectric Constant 3.74 at 1 kHz Volume Resistivity ≥ 2 x 1013 Ohm-cm at 23 °C (74 °F) Power Factor 0.003 at 1 kHz Dissipation Factor 0.011 at 1 kHz Thermal Properties Flash Point Part A 204 °C (400 °F) Part B 93 °C (200 °F) Glass Transition Temperature (Tg) ≥ 90 °C (194 °F) Heat Deflection Temperature 150 °C (302 °F) Degradation Temperature (TGA) 375 °C (707 °F) Coefficient of Thermal Expansion (CTE) Below Tg 39 x 10-6 in/in/°C Above Tg 175 x 10-6 in/in/°C www.alliedhightech.com Allied High Tech Products, Inc. Call for more information: 800.675.1118