EpoxyBond 14 Use and Mixing Instructions

Refer to the original PDF for tables, figures and page layout.

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EpoxyBond 14™ Product Use Instructions 
 
 
 
 
 
 
 
Warning/Danger 
 
 
 
 
 
 
 
Refer to the SDS document for additional 
safety information. 
 
Protective Equipment 
 
 
 
 
 
Measuring/Mixing Directions 
 
1) Place a small measuring/mixing cup (#71-10000-C) on a scale 
and tare/zero the display. 
2) With a pipette, transfer the desired volume of Part A into the 
measuring/mixing cup. Calculate the desired weight of Part B 
needed by multiplying the weight of A by 0.25.  
3) Tare/zero the display, then use a pipette to draw and transfer 
Part B into the measuring/mixing cup until the value reflects 
the addition of the 25% weight of Part B. 
4) Remove and thoroughly mix the components for at least 30 s 
to ensure homogeneity of the mixture. 
5) Use as needed based on the application. 
 
Application Examples 
 
Fill open/decapsulated cavities to stabilize for 
cross-section or backside prep/thinning of 
the die. 
 
 
 
 
 
For porous rock/geological samples, the low viscosity of EpoxyBond 
14™ effectively penetrates open cavities to help stabilize the open 
matrix to keep it together when grinding/polishing.   
 
 
Rev A: 5/2021 
Description 
EpoxyBond 14™ is a pourable, low viscosity, clear, 
two-part, amine-based epoxy adhesive. It is both 
chemical resistant and stable under high vacuum 
when cured. 
 
The (#71-10025) kit is supplied with forty (40) mixing 
cups.  Pipettes are needed for transferring part A and B 
into the mixing cups and a scale with 0.01 g resolution is 
recommended. 
 
Different batches, product age, storage conditions and 
applications may yield varying results. 
 
 
Mixing Ratio, by WEIGHT 
4:1 (Part A: Part B) 
 
Curing Schedule 
1 h @ 65 °C  
OR 
24 h @ 23 °C 
 
Specifications 
Pot Life = 1-2 hours, at 24 °C (75 °F) 
Viscosity = 100-200 cps (@ 100 RPM/23 °C) 
 
Cured Hardness 
~ 85 Shore D 
 
 
Applications 
EpoxyBond 14™ is intended for use in low volume 
applications.  In geological/petrographic applications it is 
excellent for adhering porous rock samples to glass slides 
prior to grinding/polishing.   
 
For electronic applications it fills in open cavities of 
decapsulated die in package for backside thinning for FA 
and can be used to fill/stabilize open cavity LED modules.  
For PCB microvias, it is effective (with vacuum) filling 
open vias where acrylics may not adequately penetrate to 
provide the necessary support for cross-sectioning. 
 
EpoxyBond 14™ is soluble in #145-50210 Epoxy 
Dissolver. 
 
 
Storage/Shelf Life 
Keep containers stored at room temperature – refrigeration is 
unnecessary and not recommended. 
 Expected shelf life is one (1) year but refer to best by date 
provided on package to ensure freshness. 
 
For additional information or questions, please contact us at: 
info@alliedhightech.com 
EpoxyBond 14 
Two-Part Epoxy Adhesive 
GHS08 
GHS09 
GHS05