EpoxyMount Use & Mixing Instructions

Refer to the original PDF for tables, figures and page layout.

Page 1
Product Guide 
EpoxyMount Epoxy Mounting Resin 
Date: 02/2021, v1.7 
Refer to the SDS document for 
additional safety information. 
EpoxyMount is a clear, 2-hour, room 
temperature curing, cold mounting 
epoxy resin for potting/encapsulation 
of metallographic samples. It exhibits 
excellent adhesion, very low shrinkage, 
and low viscosity, allowing it to 
penetrate open pores and cavities to 
maximize edge retention and support. 
Instructions 
1. Clean the sample using micro organic soap, isopropyl alcohol and/or an ultrasonic
cleaner to improve mounting material adhesion and prevent outgassing. Dry with heat
or clean air to remove all moisture prior to mounting.
2. Using a scale with 0.1 g precision, weigh and mix components in a single plastic cup.
Note: Do not use wax lined or paper cups. Unless they are cooled in water, the use of
disposable mounting cups is also not recommended to avoid melting the cup itself.
3. Mix thoroughly by scraping both the sides and bottom of the mixing cup for
approximately 2-3 minutes until the mixture appears homogenous.
4. Pour the mixture over the sample in the mounting cup.
5. Let the mount harden/cure.
Note: If pouring more than 200 g of epoxy at once, the epoxy may generate too much heat 
and cause smoking and fuming, as well as degradation of the sample and the mold. Reducing 
the amount of epoxy mixed and poured at once may help reduce heat and allow for a better 
cure. It is recommended to mix about 150 g at a time and to pour no more than can cover 
0.5"-1" segments. Use of a conductive mold, like a steel cylinder, can also reduce heat. 
Eliminating Bubbles & Air Pockets 
Vacuum impregnation and/or a pressure chamber can be used to eliminate bubble formation by 
filling open pores and cavities, which can interfere with adhesion of the mounting resin to the 
sample and can collect debris during grinding and polishing. Debris will contaminate the 
polishing cloths, leaving scratches on the polished surface. After pouring the epoxy, place the 
cup into the vacuum chamber and vacuum for 3-5 minutes at 25-30 inHg. Release the vacuum 
slowly. Then, cure the mount in a pressure chamber at 25-30 psi. 
Technical Information 
Mixing Ratio (by weight) 
10:3 (Resin: Hardener)* 
Mixed Viscosity 
350-500 cP
Curing Schedule 
(Room Temperature) 
(1.25" ø x 1" H mount) 
2 hours* 
Pot Life 
25 minutes at 100 g 
Peak Exothermic 
Curing Temperature 
66 °C (150 °F)* 
Durometer Hardness 
87D 
Shrinkage 
0.00008%, Inch/Inch 
Izod Impact/Tensile Strength 
0.94/7600 psi 
Glass Transition 
Temperature 
140 °C (284 °F) 
Light Refractive Index 
1.519 
* Optimum mixing ratio; larger volume mixtures cure at higher
temperatures and faster rates.
GHS07 
GHS05 
GHS09 
www.alliedhightech.com 
Allied High Tech Products, Inc. 
Call for more information: 800.675.1118 


Page 2
www.alliedhightech.com 
Allied High Tech Products, Inc. 
Call for more information: 800.675.1118 
2 of 2 
Table 1: EpoxyMount Standard Curing Parameters 
Mount Size 
Cure Time 
(Hours)* 
Mixing Ratio 
Weight (g)** 
Resin 
Hardener 
1"/ 25 mm 
2-3
10:3.5 
10.77 
3.77 
1.25"/ 32 mm 
1.5-2 
10:3 
17.5 
5.25 
1.5"/ 38 - 40 mm 
1-1.5
10:3 
25.19 
7.56 
2"/ 50 mm 
1-2
10:2.5 
36.67 
9.17 
* Variations in room temperature and mixing ratios will influence performance and the data in the table above. The
larger the mass, the higher the exothermic temperature reached during curing and the faster the epoxy will cure.
Place large molds into a shallow bath of water to reduce exothermic heat. Measure both parts with the same cup.
** Per one (1) mount 
45-Minute Cure Time
The cure time for EpoxyMount can be shortened from 2 hours to 45 minutes by adding heat. 
Once a mount is ready to cure, heat it on a hot plate or in an oven at 38 °C (100 °F) for 10-15 
minutes. This is not recommended for heat-sensitive specimens. 
Back-Filling 
Back-filling is a process where a sample with an inaccessible area that needs support is 
mounted, ground to expose the air pocket and then remounted in epoxy. Vacuum is used to 
pull the air from the pocket that is displaced with epoxy, providing support to the structure. 
When back-filling, be sure to use enough epoxy to fully cure and harden. 
Crystallization 
When stored in cool conditions, crystallization of the resin (Part A) may occur. To dissolve the 
crystals, loosen the cap and heat the bottle to 38 °C (100 °F) for 30 minutes. Allow it to cool to 
room temperature before using. 
Sample Removal 
EpoxyMount is non-soluble in water when cured. If a sample needs to be removed from epoxy 
that is cured or not fully cured, it can be dissolved using Allied’s Epoxy Dissolver (#145-50210). 
The time required to dissolve the epoxy can be reduced if the excess is ground or cut prior.