EpoxySet Use & Mixing Instructions

Refer to the original PDF for tables, figures and page layout.

Page 1
Product Guide 
www.alliedhightech.com 
Allied High Tech Products, Inc. 
Call for more information: 800.675.1118 
EpoxySet Epoxy Mounting Resin 
Date: 10/2020, v1.7 
Refer to the SDS document for 
additional safety information. 
EpoxySet is a colorless, clear cold 
mounting epoxy resin for 
potting/encapsulation of metallographic 
samples that cures in 8 hours at room 
temperature. It exhibits excellent 
adhesion, very low shrinkage and 
minimal viscosity, allowing it to 
penetrate open pores and cavities to 
maximize edge retention and support. 
Instructions 
1. Clean the sample using micro organic soap, isopropyl alcohol and/or an ultrasonic
cleaner to improve mounting material adhesion and prevent outgassing. Dry with heat
or clean air to remove all moisture prior to mounting.
2. Using a scale with 0.1 g precision, weigh and mix components in a single plastic cup.
Note: Do not use wax lined or paper cups. Unless they are cooled in water, the use of
disposable mounting cups is also not recommended to avoid melting the cup itself.
3. Mix thoroughly by scraping both the sides and bottom of the mixing cup for
approximately 2-3 minutes until the mixture appears homogenous.
4. Pour the mixture over the sample in the mounting cup.
5. Let the mount harden/cure.
Note: If pouring more than 200 g of epoxy at once, the epoxy may generate too much heat 
and cause smoking and fuming, as well as degradation of the sample and the mold. Reducing 
the amount of epoxy mixed and poured at once may help reduce heat and allow for a better 
cure. It is recommended to mix about 150 g at a time and to pour no more than can cover 
0.5"-1" segments. Use of a conductive mold, like a steel cylinder, can also reduce heat. 
Technical Information 
Mixing Ratio (by weight) 
100:12 (Resin:Hardener)* 
Mixed Viscosity 
300 cP 
Curing Schedule 
(Room Temperature) 
(1.25" ø x 1" H mount) 
6-10 hours*
Pot Life 
2 hours @ 100 g 
Peak Exothermic 
Curing Temperature 
54 °C (130 °F)* 
Durometer Hardness 
89D 
Shrinkage 
0.00008%, Inch/Inch 
Izod Impact/Tensile 
Strength 
0.94/7600 psi 
Glass Transition 
Temperature 
55-75 °C (131-167 °F)
Light Refractive Index 
1.519 
* Optimum mixing ratio; larger volume mixtures cure at
higher temperatures and faster rates.
GHS07 
GHS08 
GHS05 
GHS09 


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Table 1: EpoxySet Standard Curing Parameters 
Mount Size 
Cure Time 
(Hours)* 
Mixing Ratio 
Weight (g)** 
Resin 
Hardener 
1"/ 25 mm 
8-10
100:13 
12.87 
1.67 
1.25"/ 32 mm 
6-8
100:12 
20.31 
2.44 
1.5"/ 38 - 40 mm 
4-6
100:11 
29.51 
3.25 
2"/ 50 mm 
3-4
100:8.5-10 
41.67 
4.17 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
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Allied High Tech Products, Inc. 
Call for more information: 800.675.1118 
time required to dissolve the epoxy can be reduced if the excess is ground or cut prior.
is cured or not fully cured, it can be dissolved using Allied’s Epoxy Dissolver (#145-50210). The
EpoxySet is non-soluble in water when cured. If a sample needs to be removed from epoxy that
Sample Removal
When back-filling, be sure to use enough epoxy to fully cure and harden.
pull the air from the pocket that is displaced with epoxy, providing support to the structure.
mounted, ground to expose the air pocket and then remounted in epoxy. Vacuum is used to
Back-filling is a process where a sample with an inaccessible area that needs support is
Back-Filling
not recommended for heat-sensitive specimens.
mount is ready to cure, heat it on a hot plate or in an oven at 38 °C (100 °F) for 1 hour. This is
The cure time for EpoxySet can be shortened from 8 hours to 2 hours by adding heat. Once a
2-Hour Cure Time
slowly. Then, cure the mount in a pressure chamber at 25-30 psi.
cup into the vacuum chamber and vacuum for 3-5 minutes at 25-30 inHg. Release the vacuum
polishing cloths, leaving scratches on the polished surface. After pouring the epoxy, place the
sample and can collect debris during grinding and polishing. Debris will contaminate the
filling open pores and cavities, which can interfere with adhesion of the mounting resin to the
Vacuum impregnation and/or a pressure chamber can be used to eliminate bubble formation by
Eliminating Bubbles & Air Pockets
** Per one (1) mount
molds into a shallow bath of water to reduce temperature. Measure both parts with the same cup.                        
larger the mass, the higher the temperature reached during curing and the faster the epoxy will cure.Place large 
* Variations in room temperature and mixing ratios will influence performance and the data in the table above. The