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PRODUCT USE INSTRUCTIONS

PRODUCT USE INSTRUCTIONSOpen original PDFAlso listed as: Epoxy Dissolver InstructionsFull searchable text · 1 pagesRefer to the original PDF for tables, figures and page layout.Page 1 Product Guide www.alliedhightech.com Allied High Tech Products, Inc. Call for more information: 800.675.1118 Epoxy Dissolver Date: 10/2020, v1.5 Refer to the SDS document for additional safety information. Technical Information Odor Fruity Solubility Miscible in Water Specific Gravity 1.1 Boiling Point 189 °C (372…

Publication details

Manufacturer / publisherAllied High Tech Products
LanguageEnglish
Captured2026-10-17
Document typeguides
PDF pages1
CategoryLapping, honing & superfinishing
Updated2026-10-17T20:52:43.954326+00:00
Allied High Tech published content
Source: https://www.alliedhightech.com/Media/Default/images/PG%20-%20Epoxy%20Dissolver%20v1.5.pdf. Manufacturer claims and terminology are reproduced as source material.Explore Product guides & preparation notes ↗

PRODUCT USE INSTRUCTIONS

Open original PDF

Also listed as: Epoxy Dissolver Instructions

Full searchable text · 1 pages

Refer to the original PDF for tables, figures and page layout.

Page 1
Product Guide 
www.alliedhightech.com 
Allied High Tech Products, Inc. 
Call for more information: 800.675.1118 
Epoxy Dissolver 
Date: 10/2020, v1.5 
Refer to the SDS document for 
additional safety information. 
Technical Information 
Odor 
Fruity 
Solubility 
Miscible in Water 
Specific Gravity 
1.1 
Boiling Point 
189 °C (372 °F) 
Flash Point 
89 °C (192 °F) 
Auto-Ignition Point 
300 °C (572 °F) 
Vapor Pressure 
0.46 mm/Hg @ 20 °C 
(68 °F) 
Vapor Density 
2.7 (Relative to Air = 1) 
VOC Content 
9.1 lbs/gal 
Epoxy Dissolver is a powerful blend of solvents 
designed for the removal of cured epoxy systems. 
This translucent pink liquid is particularly effective 
against transfer molded epoxy systems and is not 
a true solvent for epoxies; it causes disintegration 
of these cured systems by stretching and 
breaking the polymeric bonds of the cured 
materials. It has a neutral pH, and it will not 
affect electronic materials in active components, 
including silicon. Epoxy Dissolver reacts with 
acids and may react with oxidizing agents. 
Epoxy Dissolver works with epoxy molding 
compounds such as Allied’s EpoxyMount, 
EpoxySet and EpoxyBond 110, epoxy casting 
compounds, most thermoplastic materials, wire 
coatings and many thermosetting coatings; it 
may also work with other epoxy systems. 
Observe proper safety precautions when 
experimenting with other materials. 
Instructions 
1. Cut or grind away as much of the epoxy from the specimen as possible to shorten the
time it takes to remove the encapsulant.
2. Pour Epoxy Dissolver into a glass, aluminum or stainless steel beaker, and then submerge
the sample completely. Do not use a plastic container.
3. Place the beaker onto a hot plate and heat to 150 °C (302 °F). Upon heating, the solution
may darken. Use in a well-ventilated area, and do not heat with an open flame or
oven.
Note: Lower temperatures may be used; however, the Epoxy Dissolver may not be as
effective. For fastest decapsulation, use the maximum heat that the sample can withstand
up to 150 °C.
4. Epoxy Dissolver will cause epoxy to flake off; it will not go fully into solution. Once the
epoxy has completely flaked off the sample, allow the Epoxy Dissolver to cool to room
temperature. Use metal tongs to remove the sample from the beaker.
5. Wash the sample in water, isopropyl alcohol or acetone to remove any residual Epoxy
Dissolver. Filter out solid materials from the Epoxy Dissolver to reuse it.
Storage 
Store Epoxy Dissolver above 21 °C (70 °F) as it can freeze below 16 °C (60 °F). If it does 
freeze, warming it to 21 °C or above will dissolve the crystallized solids; the crystallization will 
not affect the stability or effectiveness. 
GHS07 

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PG - Epoxy Dissolver v1.5.pdf ↓

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