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Wafering Blades - Diamond Metal Bond

Consumables > Sectioning > Wafering Blades - Diamond Metal Bond More Views: Diamond metal bond blades are composed of an inner metal core and an outer rim. The rim consists of metal mixed with abrasive, cured under high temperature and pressure to bond the matrix together. Metal bonding offers long life and durability.High ConcentrationRecommended for general laboratory sectioning, either low (<1000 RPM) or high (>1000 RPM) speeds.Low Concentration Recommended for sectioning very hard or…

Product / SKUAllied High Tech ProductsDiamond & CBN tools

Technical specifications

Manufacturer / publisherAllied High Tech Products
LanguageEnglish
Captured2026-10-17
Part numbers60-20065; 60-20070; 60-20075; 60-20080; 60-20081; 60-20084; 60-20085; 60-20090; 60-20095; 60-20100; 60-20101; 60-20104
CategoryDiamond & CBN tools
Updated2026-10-17T21:12:06.592434+00:00
Allied High Tech published content
Source: https://consumables.alliedhightech.com/product-p/wbb.htm. Manufacturer claims and terminology are reproduced as source material.
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Wafering Blades - Diamond Metal Bond
Wafering Blades - Diamond Metal Bond
 
More Views:
Diamond metal bond blades are composed of an inner metal core and an outer rim. The rim consists of metal mixed with abrasive, cured under high temperature and pressure to bond the matrix together. Metal bonding offers long life and durability.
High Concentration
Recommended for general laboratory sectioning, either low (<1000 RPM) or high (>1000 RPM) speeds.
Low Concentration
Recommended for sectioning very hard or brittle materials such as ceramics, silicon, glass and refractories where chipping and pullout need to be minimized. Most commonly used at lower (<1000 RPM) speeds.
SAFETY DATA SHEET


Item# Item Name
60-20065 Wafering Blade, Diamond Metal Bond, High Concentration, 3" x .006" x .5" (76 x .15 x 12.7 mm)
60-20070 Wafering Blade, Diamond Metal Bond, High Concentration, 4" x .012" x .5" (102 x .31 x 12.7 mm)
60-20075 Wafering Blade, Diamond Metal Bond, High Concentration, 5" x .015" x .5" (127 x .38 x 12.7 mm)
60-20080 Wafering Blade, Diamond Metal Bond, High Concentration, 6" x .020" x .5" (152 x .51 x 12.7 mm)
60-20081 Wafering Blade, Diamond Metal Bond, High Concentration, 7" x .025" x .5" (178 x .64 x 12.7 mm)
60-20084 Wafering Blade, Diamond Metal Bond, High Concentration, 8" x .030" x .5" (203 x .76 x 12.7 mm)
60-20085 Wafering Blade, Diamond Metal Bond, Low Concentration, 3" x .006" x .5" (76 x .15 x 12.7 mm)
60-20090 Wafering Blade, Diamond Metal Bond, Low Concentration, 4" x .012" x .5" (102 x .31 x 12.7 mm)
60-20095 Wafering Blade, Diamond Metal Bond, Low Concentration, 5" x .015" x .5" (127 x .38 x 12.7 mm)
60-20100 Wafering Blade, Diamond Metal Bond, Low Concentration, 6" x .020" x .5" (152 x .51 x 12.7 mm)
60-20101 Wafering Blade, Diamond Metal Bond, Low Concentration, 7" x .025" x .5" (178 x .64 x 12.7 mm)
60-20104 Wafering Blade, Diamond Metal Bond, Low Concentration, 8" x .030" x .5" (203 x .76 x 12.7 mm)
 


Extended Information:

This product can be used with sectioning machines offered by Allied and other manufacturers Browse our machines >>




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