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PRODUCT INFORMATION

Polycrystalline Diamond Powder

GRISH Polycrystalline Diamond Dust (PCD) is produced in a controlled explosion. Under the microscope, the granular structure is shown on the left. PCD has more facets than single crystals. Therefore, better removal rate and better self-sharpening can be obtained.

Technical specifications

Manufacturer / publisherGRISH / Beijing Grish Hitech
Brand / publisherGRISH
Content typeproducts
LanguageEnglish
CategoryAbrasive grains & powders
Updated2026-10-16
GRISH published content
Source: https://grish.com/product/polycrystalline-diamond-powder/ · Original publication: 2022-10-10. Manufacturer claims and terminology are reproduced as source material.Explore Products & equipment ↗
Polishing Powder

Polycrystalline Diamond Powder

GRISH Polycrystalline Diamond Dust (PCD) is produced in a controlled explosion. Under the microscope, the granular structure is shown on the left. PCD has more facets than single crystals. Therefore, better removal rate and better self-sharpening can be obtained.
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About Polycrystalline Diamond Powder

Special Production Method

Polycrystalline diamond powder is synthesized by the explosion method and is made of primary grain aggregation of 4-7nm.

Improve Your Work Efficiency

High removal rate and good self-sharpening can achieve the precision polishing effect, and are unlikely to produce scratches.

PCD Powder
PCD Powder

Long Life

With high abrasion resistance, polycrystalline diamond powder has continuous grinding force, which decreases slowly with increasing grinding time.

Good Applicability

Suitable for processing super hard materials whose surface consists of materials of different hardness and high precision; such as sapphire substrates, optical crystals, super hard ceramics, etc.

PCD Powder

Specifications

  • Specifications
    Model Grade D10 (µm) D50 (µm) D95 (µm) Area of use
    PCD 1/8 Standard size ≥0.06 0.10-0.14 ≤0.21 End surface polishing of optical crystal, ultra-hard ceramic, Wafer substrate and Metal.
    PCD 1/4 ≥0.11 0.20-0.25 ≤0.40
    PCD 0-1 ≥0.40 0.48-0.55 ≤0.72
    PCD 0-2 ≥0.70 0.90-1.10 ≤1.50
    PCD 2-4 ≥1.80 2.70-3.00 ≤4.50 Lapping, rough polishing and back thinning and of Sapphire and Wafer Substrate.
    PCD 3-6 ≥2.80 4.00-4.40 ≤7.00
    PCD 4-8 ≥4.00 5.50-6.00 ≤8.60
    PCD 5-9 ≥4.70 6.30-7.00 ≤10.00
    PCD 5-12 ≥5.20 7.20-7.80 ≤13.00
    PCD G3 Precision size ≥2.00 2.80-3.10 ≤4.40
    PCD G3.5 ≥2.40 3.30-3.60 ≤5.00
    PCD G4 ≥2.90 3.90-4.20 ≤6.00
  • Downloads
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