Silicon Carbide Lapping Film
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Achieve Ideal End Face
With concentrated distribution of particles, uniform coating surface, evenly thickness as well as scientific arrangement of micro-powder to help you achieve an ideal end face.
Save Your Time
High-grade micro powder with certain angles is manufactured to maintain a high grinding force, which can greatly save your time in polishing and grinding.
Tailor-made for Many Applications and on Multitude of Machines
For use on most polishing machines and fixtures, including machines that run at higher speed and higher pressure.
Excellent Polishing Accuracy
As a result, with silicon wafer polishing you can achieve a more precise finish in less time. In addition, silicon carbide lapping film is also less likely to cause material damage, making it ideal for use on delicate surfaces. If you’re looking for a lapping film that can give you superior results, silicon carbide is the way to go.
SC16
SC3
Fiber-up Slurry
Final Polishing
Specifications
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Specifications
Mesh 600 1000 1200 2000 3000 4000 8000 Particle Size(µm) 30 16 15 9 5 3 1 Standard Size Round: Φ70mm, Φ110mm (4.3inch), Φ127mm (5inch), Φ203mm(8inch) Rectangle: 114mm*114mm, 152mm*152mm(6inch), 228mm*280mm (9*11inch) -
Downloads
Silicon Carbide Lapping Film Download
Applications
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Fiber Optic Polishing
For optical fiber connector cutting angle, coarse, medium and fine grinding
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Metallography Polishing
Grish provides polishing slurry and powders for Metallography Analysis and Metal Analysis
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3C
With the rise of mobile electronic devices, major manufacturers have put forward higher requirements for the surface processing.
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