Via Challenge
To get the true picture of the via plating thickness, it is essential that the cross-section is made in the exact center of the via. It is preferred to cross-section multiple vias simultaneously. This is where manual preparation becomes difficult even for the skilled person.
Solution:
A short and reproducible five-step preparation method taking only 17 minutes results in ready-to-inspect cross sections. The material removal is controlled throughout the preparation, resulting in samples exposing the exact centers of the 100 and 200 µm vias. Automated coupon extraction and preparation eliminate the risk of passing the target and contribute to high reproducibility.
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Electronics via plating preparation insight | Struers.com
Learn how to quickly and accurately assess via plating thickness for the electronics industry. Our application specialists demonstrate a 17-minute materialographic method for preparing via-plated samples for thickness analysis.