M-Bond 610 Mixing Instructions

Refer to the original PDF for tables, figures and page layout.

Page 1
Product Guide 
www.alliedhightech.com 
Allied High Tech Products, Inc. 
Call for more information: 800.675.1118 
M-Bond 610 2-Component System
Date: 10/2020, v1.3
Refer to the SDS document for additional safety information. 
M-Bond 610 is a permanent, 2-component epoxy phenolic adhesive that cures in 1 hour at
150 °C (302 °F). It is chemically resistant, provides a very thin glue line and will not outgas 
under vacuum. It is commonly used to bond multiple samples together and to adhere thinned 
samples to grids for TEM or FIB observation.
DO NOT open a resin or curing agent bottle before it has reached room temperature! 
Instructions 
1. Using the included disposable plastic funnel, empty
the contents of the bottle labeled "Curing Agent" into
the bottle labeled "Adhesive." Discard the funnel
when finished.
2. Use the included brush applicator cap to securely
close the "Adhesive" bottle and thoroughly mix the
contents by vigorously shaking it for 10 seconds.
3. Mark the bottle in the space provided on the label
with the mixing date. Allow the freshly mixed
adhesive to stand for at least 1 hour before using.
Curing must begin within 4 hours of application.
Storage 
Keep the containers closed 
when not in use. Do not store 
above 48 °C (120 °F). The 
shelf life is 9 months from 
date of manufacture when 
stored at room temperature 
(24°C; 75°F) or 15 months 
from date of manufacture 
when refrigerated (5°C; 40°F), 
which is recommended. 
Technical Information 
Mixing Ratio (by weight) 
1:1 (Resin: Curing Agent) 
Curing Schedule 
1 hour at 150 °C (302 °F) 
2.5 hours at 120 °C (248 °F) 
4 hours at 100 °C (212 °F) 
Operating 
Temperature Range 
Short Term 
-452° to +700°F (-269° to +370 °C)
Long Term 
-452° to +500°F (-269° to +260 °C)
Transducers 
to +450°F (+230 °C) 
Pot Life 
6 Weeks 
at 24 °C (75 °F) 
12 Weeks 
40 °F (5 °C) 
Elongation Capabilities 
1% at -452 °F (-269 °C) 
3% at +76 °F (+24 °C) 
3% at +500 °F (+260 °C) 
Clamping Pressure 
10 to 70 psi (70 to 480 kN/m2); 
30 to 40 psi optimum (200 to 275 kN/m2) 
Recommended Postcure 
2 hours at 50°–75°F (30°–40°C) above maximum operating 
temperature or cure temperature, whichever is higher 
High Precision Transducer Postcure 
2 hours at 400°–450°F (205°–230°C) after wiring 
GHS07 
GHS05 
GHS08 
GHS02 
GHS09