High-efficiency CMP Slurry
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Take a Closer Look
The acidic pH value is stable, maintaininga high and stable polishing rate.
Combines rough and fine polishing into a single process, greatly reducing process-ing costs and improving processingefficiency.
Test data
Microscope Photo
Semi-insulated 500X
Conductive 500X
Test Conditions and Parameter Settings
- Polishing object: 6-inch SiC substrate*3 pcs*2 Head
- Polishing pad: Suba 600
- Polishing slurry: SC-O80K (Grish)
- Pasting method: wax paste
- Pressure: 120Kg (220g/cm²)
- Speed: lower 66rpm, upper 60rpm
- Circulation barrel: 10L
- Chiller temperature: 20℃
- Polishing time: 4H
Conclusion
The total time of traditional rough polishing and fine polishing is 6-9 hours, and high-efficiency CMP can be used for 2-3 hours to meet polishing requirements.
After polishing with high-efficiency CMP, the Ra values that can be achieved on the carbon and silicon surfaces of silicon carbide are: Si: 0.115nm C: 0.127nm.
Specifications
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Specifications
Parameters Content Testing Instrument Grit Size (nm) 70-90 Laser particle analyzer Particle Appearance Spherical SEM/TEM pH 3-4 pH meter Viscosity(cst) <10 Viscometer Consentration (%) 5-10% Hydrometer Package 25kg/5kg - Remark: Customizations are available upon requests. - -
Applications
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LED & Semiconductor
Grish provide polishing products for LED & Semiconductor polishing. We offer both wet and dry polishing suspensions, as well as oil-based and water-based formulations.
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Optical Glass & Crystal
We offer a wide range of polishing products for optics, glass, and gemstones industries.
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Ceramic & Precious Materials
Grish provide powders and polishing slurry for Hard Ceramic, Sealing ring and Gemstone
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3C
With the rise of mobile electronic devices, major manufacturers have put forward higher requirements for the surface processing.
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