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POLISHX/X-Prep® Vision™ - Substrate Measurement Instrument
PRODUCT INFORMATION

X-Prep® Vision™ - Substrate Measurement Instrument

The X-Prep® Vision™ is a metrology tool that enables measurement of silicon and semitransparent substrates. It is necessary for applications that require uniform thinning to a specific target with a tolerance of +/- 3 µm or better. The X-Prep® fixture adapter is also secured to the motorized stage on the X-Prep® Vision™, ensuring the measurement/tool control coordinates remain aligned when transferred between systems. A library with over 130 materials (i.e., GaAs, InGaAs, SiC, Sapphire/Al2O3,…

Technical specifications

Manufacturer / publisherAllied High Tech Products
LanguageEnglish
Captured2026-10-17
Part numbers15-50105
CategoryMetrology & quality control
Updated2026-10-17T21:12:06.592434+00:00
Allied High Tech published content
Source: https://www.alliedhightech.com/Equipment/x-prep-vision-substrate-measurement-instrument. Manufacturer claims and terminology are reproduced as source material.Explore Equipment & specifications ↗

The X-Prep® Vision™ is a metrology tool that enables measurement of silicon and semitransparent substrates. It is necessary for applications that require uniform thinning to a specific target with a tolerance of +/- 3 µm or better.

The X-Prep® fixture adapter is also secured to the motorized stage on the X-Prep® Vision™, ensuring the measurement/tool control coordinates remain aligned when transferred between systems. 

A library with over 130 materials (i.e., GaAs, InGaAs, SiC, Sapphire/Al2O3, InP, SiGe, GaN, photo-resist) is included with every system.

Meaurement & Observation - How it Works

IR light is focused onto a sample, and a unique signal based on the refractive index of the material is created. The return signal is analyzed by the software to produce a thickness value.

Measuring Below 10 µm Thickness

For applications requiring thinning to less than 10 µm, precise measurement is possible only by adding the visible light spectrometer accessory.

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Features

Multipoint scan or single-point thickness measurement   10 microns to full thickness (1 mm) range of measurement (15 nm to 1 mm thick)
Motorized, automatic X/Y/Z (auto-focus) with <1s acquisition time   Automatic edge and corner detection aligns measurement grid with X-Prep® - including theta correction
Edge exclusion with X/Y input   Stage fitted with X-Prep® fixture adapter
"Drive to Coordinate" software navigation   Viewing of either 2D plot/map or 3D graph
Supplied with Allied proprietary X-Correct™ software   CCD camera included
Roughness - 15 micron finish   100 mm x 100 mm X/Y range of motion
Software automation extendable through .NET   Data export using standard Windows methods
One (1) year warranty   Dimensions: 14" W x 17" D x 19" H (355 x 431 x 483 mm)
Item # Description
15-50105 X-PREP® VISION™ 100 SUBSTRATE MEASUREMENT INSTRUMENT, 100-240V AC 100 mm x 100 mm X/Y stage travel

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